Digital Holographic Interferometry Cantilever Teststand

Digital Holographic Interferometry Cantilever Teststand

This self-assembled micro cantilever teststand based on digital holographic interferometry microscopy provides an oppurtunity to measure the radius of curvature of micro cantilever stress measurement chips. This nonintrusive and nondestructive measurement method allows accurate mechanical stress measurements based on the stoney equation with a resolution of 5 MPa and excellent reproducibility. Automated data acquisition allows high throughput analyses of ex situ film stress as well as in situ film stress measurements using a temperature adjustable xy-translation table. Additional features are submicron 3D-Imaging of surfaces and film thickness measurements using Dual-Wavelength Holographic Interferometry.