High-vacuum deposition chamber (K4)

High-vacuum deposition chamber (K4)

K4 is a turbo- and cryo-pumped HV deposition chamber with 3 cathodes (1x DC, 2x RF). The special feature of this system is it’s water-cooled turning substrate table on which up to 5 substrates can be mounted on rotatable subtables. During deposition the substrates pass each cathode in one full turn, creating very fine multilayer structure of the different sputter source materials. Using a set of actuator arms on the subtable as well as a rod and an actuator arm mounted on the vacuum chamber walls, the subtables are able to rotate by 90° back and forth within each turn. This together with specially designed apertures allows for the fabrication linear thickness gradients lying orthogonal to each other across the materials libraries.
The main advantage of this system is the ability to fabricate multiple materials libraries with nearly identical compositional distribution in one fabrication step. This in advantageous for annealing experiments and comparative studies involving different substrate materials.
This sputtering system was developed by the Dahn group at Dalhousie University in Halifax, Canada. Further information and publications can be found at their homepage.