Call for Papers
IMWS-AMP 2017 conference represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, chemical experts, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems. IMWS-AMP 2017 is organized by the IEEE Microwave Theory and Techniques Society (MTT-S) with the technical co-sponsorship of the European Microwave Association (EuMA). The IMWS-AMP 2017 edition will be host by the University of Pavia, Italy. The conference will feature an exciting technical program, an industry exhibit, and invited talks by worldwide recognized experts in materials and manufacturing processes.
Conference Topics
Perspective authors are cordially invited to submit papers in all areas of novel material, advanced manufacturing and processing, and integration techniques for microwave to terahertz circuits and systems, including but not limited to:
- RF, microwave and THz components and circuits based on new materials
- Advanced manufacturing processes
- Additive manufacturing & 3D-printing
- Wearable components and antennas
- Organic RF electronics and devices
- Components based on inkjet printing
- Smart materials
- Functional materials
- Artificial and engineered materials
- Microwave devices based on semiconductor materials
- Nanomaterials (e.g., graphene, CNT)
- High-speed memory materials
- Bio-materials
- Multiphysics modeling
- Material characterization
- Integration and interconnect technologies
Submitted papers should be three pages in length. Authors must adhere to the format of the IEEE conference paper template
Important Dates
| New Submission deadline: | May 15, 2017 |
| Notification of Acceptance: | June 10, 2017 |
| Final Paper Submission: | July 1, 2017 |
| Conference Date: | September 20-22, 2017 |