Hochvakuum-Magnetron Sputtersystem (K5)

Hochvakuum-Magnetron Sputtersystem (K5)

K5 is a high vacuum magnetron sputter system (Creavac GmbH, Germany) equipped with two 2” cathodes and one 4” cathode. The machine allows simultaneous sputtering of up to 3 elements. There are two DC power supplies and an RF power supply connected to this system allowing deposition of both oxides and metal targets. There is also a small evaporator for deposition of materials with Tevap.<… The typical base pressure for this system is <2 × 10-7 mbar. The system is equipped with a substrate heater for temperatures up to ~850°C. Deposition is usually conducted in ultra-high pure Ar gas (6N purity). Also reactive sputtering in O2 and N2 atmosphere is possible.
The sputter system is encased in a glovebox equipped with load-locks (SylaTech GmbH, Germany) enabling handling, storage and manipulation of the samples in a highly pure inert atmosphere (Ar: 99.9999%). This allows for the deposition of sensitive materials (e.g. alkaline metals) without oxygen or moisture contamination.
The chamber also facilitates GLAD geometry for the cathode, where the cathode can be positioned at an oblique inclination angle of ~ 88° that allows fabrication of nanostructured films. The glove box is also connected to an annealing furnace which allows a transfer of samples without exposure to air.